首页> 外文会议>Meeting of the Electrochemical Society >Large Gate Swing and High Threshold Voltage Enhancement-mode AlGaN/GaN HEMTs Using Low Energy Fluorine Ion Implantation in GaN Layer
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Large Gate Swing and High Threshold Voltage Enhancement-mode AlGaN/GaN HEMTs Using Low Energy Fluorine Ion Implantation in GaN Layer

机译:大栅极摆动和高阈值电压增强型AlGaN / GaN Hemts使用低能量氟离子注入GaN层

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Enhancement-mode (E-mode) AlGaN/GaN HEMTs with large gate swing and high threshold voltage is demonstrated in this work. The E-mode GaN HEMTs were fabricated by low energy fluorine ion implantation technique. Low energy fluorine ion implantation can provide higher fluorine ion concentration in the AlGaN layer and modulate the fluorine ion distribution in the GaN layer. The ion distribution can be also calculated by SRIM simulation. (The Stopping and Range of Ions in Matter) Without using gate insulator, the enhancement-mode GaN HEMT shows high threshold voltage of 2.5 V, with a current density of 200 mA/mm at a gate bias of 5.5 V. To confirm the implantation damages were removed, thermal stability test was performed in this work. After annealing at 400°C for 10 minutes, the implanted devices showed no obvious threshold voltage shift.
机译:在这项工作中,对具有大栅极摆动和高阈值电压的增强模式(E模式)AlGaN / GaN Hemts。通过低能量氟离子注入技术制造E模式GaN HEMT。低能量氟离子注入可以在AlGaN层中提供更高的氟离子浓度,并调节GaN层中的氟离子分布。离子分布也可以通过SRIM仿真计算。 (在不使用栅极绝缘体的情况下停止和离子的范围),增强模式GaN Hemt表示高2.5V的高阈值电压,电流密度为5.5V的栅极偏压。要确认植入除去损坏,在这项工作中进行热稳定性试验。在400℃下退火10分钟后,植入装置没有明显阈值电压偏移。

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