A New test approach is presented to measure the fracture toughness of thin films. The polysilicon specimen is a center-cracked panel that is 3.5 mu m thick and 3 mm wide with a 100 mu m long slot in the center. It subjected to tensile loading, and the crack-opening displacement is measured by interferometry. The average toughness is 1.4+-0.65 MPa-m~(1/2).
展开▼
