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Statistical Investigation of the Mechanical and Geometrical Properties of Polysilicon Films through On-Chip Tests

机译:通过片上测试对多晶硅膜的力学和几何特性进行统计研究

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摘要

In this work, we provide a numerical/experimental investigation of the micromechanics-induced scattered response of a polysilicon on-chip MEMS testing device, whose moving structure is constituted by a slender cantilever supporting a massive perforated plate. The geometry of the cantilever was specifically designed to emphasize the micromechanical effects, in compliance with the process constraints. To assess the effects of the variability of polysilicon morphology and of geometrical imperfections on the experimentally observed nonlinear sensor response, we adopt statistical Monte Carlo analyses resting on a coupled electromechanical finite element model of the device. For each analysis, the polysilicon morphology was digitally built through a Voronoi tessellation of the moving structure, whose geometry was in turn varied by sampling out of a uniform probability density function the value of the over-etch, considered as the main source of geometrical imperfections. The comparison between the statistics of numerical and experimental results is adopted to assess the relative significance of the uncertainties linked to variations in the micro-fabrication process, and the mechanical film properties due to the polysilicon morphology.
机译:在这项工作中,我们提供了多晶硅片上MEMS测试装置的微力学引起的散射响应的数值/实验研究,该装置的移动结构由细长的悬臂支撑,支撑着一块巨大的多孔板。悬臂的几何形状经过专门设计,以强调微机械效应,符合过程约束。为了评估多晶硅形态变化和几何缺陷对实验观察到的非线性传感器响应的影响,我们采用基于器件耦合机电有限元模型的统计蒙特卡洛分析。对于每个分析,通过移动结构的Voronoi细分来数字化构建多晶硅形态,然后通过从均匀概率密度函数中采样过蚀刻的值(被认为是几何缺陷的主要来源)来改变其几何形状。通过数值和实验结果统计之间的比较,来评估与微细加工过程中的变化有关的不确定性的相对重要性,以及由于多晶硅形态而导致的机械薄膜性能。

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