3D simulation of sputter deposition of titanium layers in contact holes with high aspect ratios

摘要

In this paper, we present 3D simulations of sputter deposition of titanium (Ti) which, after rapid thermal nitridation (RTN), serves as barrier layer for subsequent contact hole filling by blanket tungsten CVD. The electrical properties of the contacts highly depend on the Ti bottom coverage. In consequence, prediction of the bottom coverage by means of simulation is of high interest for optimizing the electrical properties.