Characterization of mechanical properties of thin films using micromechanical silicon device

摘要

We have developed a uni-axial tensile test structure on a single-crystal silicon chip. This enables tensile testing of MEMS materials, such as bulk silicon and thin film materials, to be earned out directly on the silicon chip. The new methodeliminates manipulating a small-sized specimen during the test procedure as in previous work. The structure was designed so that uni-axial force is applied to the specimen when a lever structure on the same chip is loaded perpendicular to the surface.Fabrication process of the test structure was developed for tensile testing of single crystal silicon. The measured fracture strains were in a range of from 0.8 to 1.2 %. The observed large strains show that the proposed testing system achieves superioruniaxial loading condition compared to the conventional testing methods.