首页> 外文会议>International Conference on Solid-State Sensors, Actuators and Microsystems amp;amp;amp;amp;amp;amp;amp;amp;amp;amp;amp;amp;amp;amp;amp; Eurosensors >A Novel Method for Mems Wafer-Level Packaging: Selective and Rapid Induction Heating for Copper-Tin Slid Bonding
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A Novel Method for Mems Wafer-Level Packaging: Selective and Rapid Induction Heating for Copper-Tin Slid Bonding

机译:一种MEMS晶圆级包装的新方法:铜锡滑动粘合的选择性和快速感应加热

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Innovative packaging techniques are essential for the development of new microsystems. To integrate different materials into one package, the thermal stress on the devices has to be minimized. This paper presents a method for selective and energy-efficient induction heating of Cu-Sn layers to support and enhance the bonding process at wafer-level. Technological challenges include the inductor design for homogeneous heating, the use of high-frequency electromagnetic fields up to frequencies of f = 2.0 MHz, and the integration of the induction equipment into an industrial wafer bonder. Infrared thermography imaging was used to characterize the selective heat generation with very fast heating rates of ΔT > 150 K/s. Consequently, the wafer bonding process could be performed in tbond = 120.0 s by applying a low pressure of p = 2.2 MPa.
机译:创新的包装技术对于开发新微系统来说是必不可少的。要将不同的材料集成到一个包装中,必须最小化器件上的热应力。本文介绍了Cu-Sn层的选择性和节能感应加热的方法,以支持和增强晶片水平的粘合过程。技术挑战包括均匀加热的电感设计,使用高频电磁场高达F = 2.0 MHz的频率,以及诱导设备将诱导设备集成到工业晶片粘合剂中。红外热成像成像用于表征具有非常快速的加热速率的选择性发热ΔT> 150k / s。因此,晶片键合过程可以在T中进行 bond = 120.0s通过施加低压P = 2.2 MPa。

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