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Analysis on channel thickness fluctuation scattering in InGaAs-OI MOSFETs

机译:Ingaas-OI MOSFET中通道厚度波动散射分析

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Recently, III-V compound semiconductors have attracted strong attention as a new channel material for post Si CMOS technologies. To fully utilize the channel properties at deeply scaled transistor node, short channel effects (SCEs) control is also very important. Therefore, we have developed extremely-thin-body (ETB) InGaAs-on-insulator (-01) structures [1]-[4]. However, mobility degradation with a decrease of body thickness (T_(body)) is critical problem to realize high performance ETB InGaAs-OI MOSFETs. Therefore, physical understanding and mobility enhancement technology are quite important. Actually, we have introduced MOS interface buffer layer, which has higher bandgap than that of channel layer, between oxide and channel, and increased the Indium (In) content in channel layer, as shown in Fig. 1 [3]-[4]. As a result, we have achieved high mobility at around T_(body) of 10 nm and have clarified the mobility enhancement mechanism [4]. In this work, we have further analyzed the effect of channel-thickness-fluctuation scattering on mobility characteristics in ETB InGaAs-OI MOSFETs.
机译:近来,III-V族化合物半导体已经引起强烈关注作为用于交硅CMOS技术的新信道的材料。为了充分利用在深深缩放晶体管节点的信道特性,短沟道效应(SCE的)控制也是很重要的。因此,我们开发了极薄的体(ETB)的InGaAs绝缘体上(-01)的结构[1] - [4]。然而,随着主体厚度(T_(体))的降低迁移率降低是实现高性能ETB的InGaAs-OI的MOSFET关键的问题。因此,物理理解和流动性增强技术是非常重要的。实际上,我们已经引入了MOS界面的缓冲层,其具有比沟道层的更高的带隙,氧化物和信道之间,并增加在沟道层的铟(In)的含量,如图1 [3] - [4] 。其结果是,我们已经实现了高迁移率在约10纳米T_(主体)和已澄清的迁移率增强机制[4]。在这项工作中,我们已经进一步分析通道厚度波动散射对ETB的InGaAs-OI的MOSFET移动特性的影响。

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