首页> 外文会议>International Conference on Multifunctional Materials and Structures >Application of Schottky Bulk-Layer Design on Double-Heterojunction Pseudomorphic AlGaAs/InGaAs/AlGaAs High Electron Mobility Transistors (DH-HEMTs)
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Application of Schottky Bulk-Layer Design on Double-Heterojunction Pseudomorphic AlGaAs/InGaAs/AlGaAs High Electron Mobility Transistors (DH-HEMTs)

机译:Schottky Bulk层设计在双异质结假形Algaas / Ingaas / Algaas高电子移动晶体管(DH-HEMTS)中的应用

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In this work, an application of wide-gap updoed-Al{sub}0.22Ga{sub}0.78As bulk to perform the field-plate gate (FP-gate) on Al{sub}0.22Ga{sub}0.78As/In{sub}16Ga{sub}84As/Al{sub}0.22Ga{sub}0.78As DH-HEMTs was investigated. The simulated FPG-devices with a bulk thickness of 1200 A, exhibit an excellent dispersing property to the electric field peak under gate electrode near to drain side, hence, the breakdown characteristics were effectively improved. Measured gate-diode performance of FPG-device presents a higher breakdown voltage (VBR) of -25.5 V than devices with single recess (SRG-device). Enhancement of device breakdown is contributive to microwave power performances. At 2.4 GHz load-pull measurement of studied devices which were biased at class AB operation, the saturated output power (P{sub}(OUT)), power gain (G{sub}P) and power-added efficiency (PAE) were 13.06 dBm (202 mW/mm), 12.8 db and 47.3% for FPG-device. These measured results of SRG-device were 10.3 dBm(107 mW/mm), 13.2 db and 38.5%, According to the simulated results, FPG-devices structuring with a bulk layer exhibit excellent performance for high breakdown and microwave power operation.
机译:在这项工作中,应用宽GAP updoEd-al {sub} 0.22ga {sub} 0.78as批量的应用,以在Al {sub} 0.22ga {sub}上执行现场板门(FP-GATE)0.78AS / IN研究了{sub} 16ga {sub} 84as / al {sub} 0.22ga {sub} 0.78as dh-hemts。堆积厚度为1200a的模拟FPG - 器件,在靠近排水侧的栅极电极下的电场峰值上表现出优异的分散性,因此,有效地提高了击穿特性。 FPG-Device的测量栅极 - 二极管性能比具有单凹槽(SRG-Device)的装置呈现-25.5V的较高击穿电压(VBR)。改进设备故障是微波功率性能的贡献。在2.4 GHz负载拉动测量上偏置在AB类操作中,饱和输出功率(P {Sub}(OUT)),功率增益(G {Sub} P)和增强效率(PAE)是FPG-Device的13.06 dBm(202mW / mm),12.8 dB和47.3%。根据模拟结果,SRG器件的这些测量结果为10.3 dBm(107mW / mm),13.2dB和38.5%,使用散装层的FPG - 器件结构具有优异的高击穿和微波功率操作性能。

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