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Adsorption-controlled growth of BiFeO3 by MBE and integration with wide band gap semiconductors

机译:通过MBE和宽带隙半导体集成的BifeO3的吸附控制生长

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BiFeO3 thin films have been deposited on (101) DyScO3, (0001) AlGaN/GaN, and (0001) SiC single crystal substrates by reactive molecular-beam epitaxy in an adsorption-controlled growth regime. This is achieved by supplying a bismuth over-pressure and utilizing the differential vapor pressures between bismuth oxides and BiFeO3 to control stoichiometry. Four-circle x-ray diffraction reveals phase-pure, epitaxial films with rocking curve full width at half maximum values as narrow as 7.2 arc seconds (0.002?°). Epitaxial growth of (0001)-oriented BiFeO3 thin films on (0001) GaN, including AlGaN HEMT structures, and (0001) SiC has been realized utilizing intervening epitaxial (111) SrTiO3 / (100) TiO2 buffer layers. The epitaxial BiFeO3 thin films have two in-plane orientations: [112??0] BiFeO3 ?? [112??0] GaN (SiC) plus a twin variant related by a 180?° in-plane rotation. This epitaxial integration of the ferroelectric with the highest known polarization, BiFeO3, with wide band gap semiconductors is an important step toward novel field-effect devices.
机译:通过吸附对照的生长制度在吸附控制的生长状态下,BifeO3薄膜已经沉积在(101)DySCO3,(0001)AlGaN / GaN和(0001)SiC单晶基质上。这是通过在压力上供应铋并利用铋氧化物和BIFEO3之间的差动蒸气压力来实现这一点来实现的实现。四圆X射线衍射显示相纯,外延薄膜,摇摆曲线全宽在半最大值下,如7.2电弧秒(0.002Ω°)。的外延生长(0001)取向上(0001)的GaN,的BiFeO3薄膜包括的AlGaN HEMT结构,和(0001)的SiC一直利用居间外延(111)的SrTiO 3 /(100)的TiO 2的缓冲层来实现。外延BifeO3薄膜具有两个面内取向:[112吗?0] BifeO3 ?? [112吗?0] GaN(SiC)加上一个双变型,接管面内旋转180?°。这种具有宽带隙半导体的最高已知极化的铁电的外延整合BifeO3是朝向新型场效应装置的重要步骤。

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