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Annealing of Aluminum Implanted 4H-SiC: Comparison of Furnace and Lamp Annealing

机译:铝的退火植入4H-SIC:炉子和灯退火的比较

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Furnace annealing and lamp annealing of aluminum implanted layers in 4H silicon carbide (SiC) were investigated with respect to surface degradation and electrical parameters. A sheet resistance of about 20k OMEGA/square was obtained for an aluminum implantation dose of 1.2 centre dot 10~(15)cm~(-2) and annealing in the furnace at 1700 deg C for 30min. For the same implantation dose, lamp annealing at 1770 deg C for 5min resulted in a three times higher sheet resistance of 60k OMEGA/square. The surface roughness was best for the lamp system and stayed below 1 nm for Al doses lower than 1 centre dot 10~(15)cm~(-2).
机译:关于表面劣化和电气参数研究了4H碳化硅(SiC)中铝植入层的炉退火和灯退火。获得约20kω/平方的薄层电阻,得到1.2中心点10〜(15)cm〜(-2)的铝注入剂量,并在炉内在1700℃下退火30min。对于相同的植入剂量,在1770℃下的灯退火5min导致60kω/平方的薄层电阻的三倍。表面粗糙度最适合灯系统,并且对于低于1中心点10〜(15)cm〜(2)的Al剂量低于1nm。

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