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Low Density of Interface States in n-type 4H-SiC MOS Capacitors Achieved by Nitrogen Implantation

机译:通过氮气植入实现的N型4H-SIC MOS电容器中的界面状态低密度

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A surface-near Gaussian nitrogen (N) profile is implanted into n-type 4H-SiC epilayers prior to a standard oxidation process. Depending on the depth of the oxidized layer and on the implanted N concentration, the density of interface states D_(IT) determined in corresponding 4H-SiC MOS capacitors decreases to a minimum value of approx. 10~(10) cm~(-2)eV~(-1) in the investigated energy range (E_C-(0.1 eV to 0.6 eV)), while the flat-band voltage increases to negative values due to generated fixed positive charges. A thin surface-near layer, which is highly N-doped during the chemical vapour deposition growth, leads to a reduction of D_(IT) only close to the conduction band edge.
机译:在标准氧化过程之前,将表面接近高斯氮(N)型曲线植入N型4H-SiC脱膜。根据氧化层的深度和植入的N浓度,在相应的4H-SIC MOS电容器中确定的接口状态D_(IT)的密度降低到最小值的最小值。 10〜(10)cm〜(-2)eV〜(-1)在调查的能量范围内(E_c-(0.1eV至0.6eV)),而平频带电压由于产生的固定正电荷而增加到负值。在化学气相沉积生长期间高度n掺杂的薄表面近层导致仅靠近导带边缘的D_(IT)的减少。

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