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Very High Growth Rate Epitaxy Processes with Chlorine Addition

机译:非常高的生长速率外延加入氯添加

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The growth rate of 4H-SiC epi layers has been increased by a factor 19 (up to 112 μm/h) with respect to the standard process with the introduction of HCl in the deposition chamber. The epitaxial layers grown with the addition of HCl have been characterized by electrical, optical and structural characterization methods. An optimized process without the addition of HCl is reported for comparison. The Schottky diodes, manufactured on the epitaxial layer grown with the addition of HCl at 1600 °C, have electrical characteristics comparable with the standard epitaxial process with the advantage of an epitaxial growth rate three times higher.
机译:在沉积室中引入HCl,4H-SiC ePI层的生长速率已经增加了19(高达112μm/ h)的标准方法。通过添加HCl生长的外延层已经表征了电,光学和结构表征方法。报告了未加入HCl的优化过程进行比较。在1600℃下加入HCl的外延层制造的肖特基二极管具有与标准外延过程相当的电特性,其具有外延生长速率的优点。

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