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Improvement of Electrical Characteristics of Ion Implanted 4H-SiC MESFET on a Semi-insulating Substrate

机译:在半绝缘基板上改进离子植入的4H-SiC MESFET的电特性

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The electrical characteristics of a SiC-MESFET are affected by the channel structure characteristics, such as impurity density and thickness. MESFETs fabricated with ion implantation technique, can form thinner and higher doped channel layers than those fabricated with conventional epitaxial growth, thus improve RF characteristics of MESFETs. We calculated the doping profile of the channel layer for an ion implanted SiC-MESFET using a simulator and then fabricated a SiC-MESFET with the same doping profile as obtained from the simulation. The ion implanted SiC-MESFET operated successfully and had the same electrical characteristics as the epitaxial SiC-MESFET. We demonstrated the effectiveness of one-step implantation channel layer for the ion implanted SiC-MESFET.
机译:SiC-MESFET的电特性受通道结构特性的影响,例如杂质密度和厚度。采用离子注入技术制造的MESFET,可以形成比具有常规外延生长的较薄且较高的掺杂通道层,从而改善了MESFET的RF特性。我们计算了使用模拟器的离子注入的SiC-MESFET的沟道层的掺杂轮廓,然后用与模拟中获得的具有相同的掺杂曲线制成SiC-MESFET。离子植入的SiC-MESFET成功操作并具有与外延SiC-MESFET相同的电气特性。我们证明了一步植入沟道层为离子注入的SiC-MESFET的有效性。

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