Analysis of Higfa-Q On-Chip Inductors Realized by Wafer-Level Packaging Techniques

摘要

Thin-film Wafer-Level Packaging (WLP) techniques have been used to realise high-Q on-chip inductors on 20Ohm.cm Si wafers. The electromagnetic analysis has been completed using the 3-D field simulator HFSS. A very good agreement has been obtained between the experiments and simulations. Further simulations have been performed to investigate the influence of the Cu and dielectric thickness, substrate-material, etc., which may be used as guidelines for further performance improvement.