PoP Package Warpage Contributors' Characterization and Impact Analysis

摘要

Package-on-package (PoP) technology has been widely adopted in application processor's construction for today's mobile equipment such as smart phones and tablets. One of the key tasks in a successful PoP configuration is the PoP bottom package's warpage control. Due to shorter and shorter schedule demand of such configuration's development and execution - sometimes it could be as little as half a year, the development process to identify a optimized PoP bottom package cannot take the traditional way of multiple iterations through large scale, time consuming and complex DOE's. It is therefore needed to study and understand the key warpage contributors and how significant each contributor's impact is so that educated preliminary packaging parameters can be set and intelligent DOE's can be designed. This is the major purpose of this paper.