Package-on-package (PoP) technology has been widelyadopted in application processor’s construction for today’smobile equipment such as smart phones and tablets. One ofthe key tasks in a successful PoP configuration is the PoPbottom package’s warpage control. Due to shorter and shorterschedule demand of such configuration’s development andexecution – sometimes it could be as little as half a year, thedevelopment process to identify a optimized PoP bottompackage cannot take the traditional way of multiple iterationsthrough large scale, time consuming and complex DOE’s. Itis therefore needed to study and understand the key warpagecontributors and how significant each contributor’s impact isso that educated preliminary packaging parameters can be setand intelligent DOE’s can be designed. This is the majorpurpose of this paper.
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