Epoxy resin composition for preventing warpage of a substrate for POP type package

摘要

The present invention relates to an epoxy resin composition for preventing warpage of the substrate for POP type package , and more particularly Preferably, the low temperature cure is possible to prevent the deformation of the thin-film substrate during the curing and hardening after a high heat distortion temperature got a low-temperature curability to be useful as structural materials that can prevent the bending of the thin-film substrate role , adhesion properties , working castle , storage stability , high heat distortion temperature, relates to one-pack type epoxy resin composition exhibiting excellent properties . ;