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The influence of the interface trap densites on the extraction of the silicon film and front oxide thickness of SOI nmos devices at low temperatures

机译:界面陷阱密度对低温下SOI NMOS器件硅膜和前氧化物厚度的影响

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Interface trap densities can have a strong influence on the electrical performance of MOS devices, mainly at low temperatures. This work presents a technique to extract the silicon film and front oxide thickness on fully depleted SOI nMOSFETs considering the influence of this parameter at low temperatures. The proposed technique exploits the influence of the front/back gate voltages on the back/front channel current regime respectively. Bidimensional numerical simulations were used to support the analysis.
机译:接口陷阱密度可以对MOS器件的电气性能产生强烈影响,主要是在低温下。本作品呈现了在低温下考虑该参数的影响的完全耗尽的SOI NMOSFET上提取硅膜和前氧化物厚度的技术。所提出的技术分别利用前/后栅极电压的影响分别对后/前沟道电流状态的影响。使用BIDimensional数值模拟来支持分析。

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