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The Influence of Temperature, Fluence, Dose Rate, and Helium Production on Defect Accumulation and Swelling in Silicon Carbide

机译:温度,流量,剂量率和氦气生产对碳化硅缺陷积累和肿胀的影响

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Swelling and microstructure of silicon carbide (SiC) are studied by means of MeV-range ion irradiation. The material used is chemical vapor deposited high purity polycrystalline cubic (3C)-SiC. The swelling behavior is characterized by precision interferometric profilometry following ion bombardment to the diamond-finished surface over a molybdenum micro-mesh. Irradiation was carried out at temperatures up to 873 K, followed by profilometry at room temperature. Micro structural characterization by means of cross-sectional transmission electron microscopy has also been finished for selected materials. Irradiation induced swelling was increased with increasing the displacement damage level up to 0.3 dpa at all evaluated temperatures. At 333 K, the swelling was increased with increasing the damage level up to 1 dpa, and irradiation-induced amorphization was observed over 1.07 dpa. At the higher irradiation temperature, swelling was saturated over 0.3 dpa. The temperature dependence of saturated swelling obtained so far appeared very close to the neutron irradiation data. For the study of the synergism of displacement damage and helium production, a dual-beam experiment was performed up to 100 dpa at 873 K. Swelling of the dual-beam irradiated specimen was larger than that of single-beam irradiated specimen. The result also suggested the onset of unsteady swelling in high He/dpa conditions after "saturated point defect swelling" is once achieved at displacement damage levels over 50 dpa.
机译:通过MEV范围离子照射研究了碳化硅(SiC)的肿胀和微观结构。所用材料是化学气相沉积的高纯度多晶立方(3C)-SIC。膨胀行为的特征在于,在钼微网上将离子轰击到金刚石成品表面之后的精确干涉式轮廓测定。在高达873k的温度下进行辐射,然后在室温下进行轮廓测量法。通过横截面透射电子显微镜的微结构表征也已经完成了所选材料。随着在所有评估的温度下,增加了损伤损伤水平高达0.3dPa的位移损伤水平增加,辐照诱导肿胀增加。在333 k下,随着增加损伤水平的损伤水平增加,肿胀率增加到1 dPa,并且观察到辐照诱导的杂化在1.07dPa上观察到。在较高的照射温度下,溶胀饱和超过0.3dPa。迄今获得的饱和溶胀的温度依赖性非常靠近中子辐射数据。为了研究位移损伤和氦产量的协同作用,在873K的情况下进行双梁​​实验。双束照射标本的肿胀大于单梁照射标本的溶胀。结果还表明在“饱和点缺陷肿胀”曾经在50dPa超过50dPa的位移损伤水平下实现后,在高时肿胀的发作。

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