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Production of contacts and conducting pathways in or on crystalline silicon carbide semiconductor substrates comprises implanting aluminum in the substrates at a specified temperature with a specified ion dose and energy
Production of contacts and conducting pathways in or on crystalline silicon carbide semiconductor substrates comprises implanting aluminum in the substrates at a specified temperature with a specified ion dose and energy
Production of contacts and conducting pathways in or on crystalline silicon carbide semiconductor substrates comprises implanting aluminum in the substrates at 300-1000 deg C with an ion dose of 3 x 1017 to 3 x 1018 cm-2 and an ion energy of 200 keV to 5 MeV. Preferred Features: The ion implantation is carried out in several stages. The parameters are selected differently in the individual stages. The substrates are cured at 1000-1800 deg C after ion implantation.
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机译:在结晶碳化硅半导体衬底中或之上的接触和导电路径的产生包括在300-1000摄氏度下以3 x 10 17至3 x 10 18 cm -2的离子剂量将铝注入衬底中。离子能量为200 keV至5 MeV。优选特征:离子注入分多个阶段进行。在各个阶段中,对参数的选择不同。离子注入后,将基板在1000-1800摄氏度下固化。
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