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Development of silicon carbide substrates by carbonization and ion implantation of single-crystalline substrates.

机译:通过碳化和单晶衬底的离子注入开发碳化硅衬底。

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Mechanisms of formation involved in both thin films and crystalline precipitates of silicon carbide (SiC) are studied in this Ph. D. thesis. SiC is fabricated starting from single-crystalline silicon (Si) substrates by carbonization or by ion implantation. The characterization of these structures allows to gather data and better physical and chemical understanding of these systems.; The main objectives are (i) the fabrication and characterization of SiC and other interesting crystalline phases obtained from Si wafers and (ii) to demonstrate that these products are a viable way for using them as templates, compliant, seed or buffer layers in SiC or III-N overgrowth by epitaxial growth techniques. These approaches let the consecution of a crystalline quality enough to the development of devices. Indeed, their use allow a significant reduction of the high defect density present in III-N or SiC alloys compared to their quality when directly grown on Si. Therefore, long life are foreseen for electronic devices that could use these substrates. This is the limit needed for the beginning of their industrial production and commercialization.; Samples studied in this work are framed inside three groups: (1) Silicon Carbide and other phases (Silicon Nitride (Si3N4) and carbon nitride (C3N4)) synthesized by Silicon ion implantation, (2) Silicon Carbide synthesized by Si carbonisation and (3) Silicon Carbide and Gallium Nitride heteroepitaxial growth on carbonized Si. All these structures are fabricated by techniques derived from classic (i) Ion Beam Induced Crystallization (IBIC), (ii) Chemical Vapour Deposition (CVD) or (iii) Molecular Beam Epitaxy (MBE). Structural characterizations are carried out mainly by (i) Scanning Electron Microscopy (SEM), (ii) Transmission Electron Microscopy (TEM), (iii) Fourier Transform Infra Red Spectrometry (FTIR) and other techniques.
机译:在本博士学位论文中研究了薄膜和碳化硅(SiC)晶体沉淀物的形成机理。 SiC是通过碳化或离子注入从单晶硅(Si)基板开始制造的。这些结构的特征允许收集数据并更好地了解这些系统。主要目标是(i)从硅片中获得的SiC和其他有趣的结晶相的制造和表征,以及(ii)证明这些产品是将其用作SiC或SiC中的模板,顺应层,晶种或缓冲层的可行方法III-N通过外延生长技术过度生长。这些方法使晶体质量足以用于器件的开发。实际上,与直接生长在Si上的质量相比,它们的使用可以显着降低III-N或SiC合金中存在的高缺陷密度。因此,可以使用这些基板的电子设备预计将具有长寿命。这是开始其工业生产和商业化所需的极限。在这项工作中研究的样品分为三类:(1)碳化硅和其他相(氮化硅(Si 3 N 4 )和氮化碳(C 3 N 4 )),通过硅离子注入法合成,(2)通过碳化硅合成的碳化硅,以及(3)碳化硅上碳化硅和氮化镓异质外延生长。所有这些结构都是通过经典(i)离子束诱导结晶(IBIC),(ii)化学气相沉积(CVD)或(iii)分子束外延(MBE)衍生的技术制造的。结构表征主要通过(i)扫描电子显微镜(SEM),(ii)透射电子显微镜(TEM),(iii)傅里叶变换红外光谱(FTIR)和其他技术进行。

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