Post-CMP cleaning is most often judged bythe cleaning of blanket, planar surfaces. While this is quick and demonstrates the ability to remover particles from simple surfaces, it does not enable us to known what occurs in cleaning the more complex surfaces where topographic relief is involved, as well as slurry left on the edge bevel after cleaning. This paper will describe a more complete cleaning process over the traditional, scrubber method. It will sho the use of megasonic cleaning methods that demonstrate significantly better cleaning performance where topgraphic recesses and edge bevels are concerned. It begs the question, "Post-CMP cleaning, scrub, megasonic, or scrub/megasonic in combination?"
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