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Effects of growth parameters on the performance of mu c-Si thin film transistors deposited using SiF_4

机译:生长参数对使用SIF_4沉积MU C-Si薄膜晶体管性能的影响

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Top-gate microcrystalline silcion ( mu c-Si) thin film transistors (TFTs) were made, to study the effects of growth parameters of mu c-Si channel on the TFT performance. The mu c-Si layers were deposited by PE-CVD from mixtures of SiH_4, SiF_4, and H_2. The growth parameters were varied in the following range: Substrate temperature from 280 to 360 deg C; gas flow rate, SiF_4 from 10 to 35 sccm, H_2 from 50 to 200 sccm, SiH_4 constant at 1 sccm; deposition pressure from 500 to 900 m STorr; and plasma power from 18 W to 54 W (power density 80 mW/cm~2 to 240 mW/cm~2). We observed the following trends in TFT performance: The electron mobility rises with rising substrate temperature, deposition pressure and H_2 flow rate. The OFF current decreases drastically with deposition power and rises rapidly with SiF_4 flow rate above 20 sccm. We identified as set of best deposition parameters.
机译:制造顶栅微晶硅基(MU C-Si)薄膜晶体管(TFT),研究MU C-Si通道生长参数对TFT性能的影响。通过SIH_4,SIF_4和H_2的混合物,通过PE-CVD沉积MU C-Si层。增长参数在以下范围内变化:衬底温度为280至360℃;气体流速,SIF_4从10到35 SCCM,H_2从50到200 SCCM,SIH_4恒定在1 SCCM;沉积压力从500到900 m storr;等离子体功率从18W到54W(功率密度80mW / cm〜2至240mW / cm〜2)。我们观察到TFT性能下列趋势:电子迁移率上升,基板温度上升,沉积压力和H_2流速。截止电流随着沉积功率而剧烈降低,并且随着SIF_4流速迅速上升20SCCM。我们标识为最佳沉积参数集。

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