One of the major reliability concerns in automotive electronic packaging is associated with interconnect failure, e.g., solder joints, due to underhood thermal fatigue loadings. The paper gives an overview of the solder joint reliability issues and some current progresses made within Ford Research Laboratory in developing life prediction methods for Pb solders and their replacements. The thermal cyclic stress/strain response and associated fatigue life of 63Sn-37Pb, 62Sn-36Pb-2Ag, 96.5Sn-3.5Ag, and a Ag-filled conductive adhesive, determined with a experimental technique developed in-house are discussed. In addition, an introduction is given to the recent development of a UNIX based design system for solder joint reliability prediction.
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