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New delay model for 0.5/spl mu/ CMOS ASIC

机译:0.5 / SPL MU / CMOS ASIC的新延迟模型

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As silicon geometry moves closer to deep sub-micron (smaller than 0.5-/spl mu/m) technology, new physical phenomena start to appear and dominate the delay through an ASIC cell. As delays become smaller and the overall performance of applications increase, the emphasis on delay calculation accuracy increases. The authors demonstrate 0.5-/spl mu/m CMOS delay related physical phenomena such as coupling and shielding effects. They show how these components affect the cell and interconnect delays. The effects of these physical phenomena on CAD technology are discussed. A delay model for 0.5-/spl mu/m CMOS ASIC technology is described. This model takes into consideration the following items: unique 0.5-micron physical phenomena; optimization of ASIC library cell characterization time; speed of delay calculator CAD tool; the requirement of interconnect extraction and calculation accuracy; and the extensibility and flexibility of the model to provide additional accuracy for future silicon technology.
机译:由于硅几何形状移动更靠近深次微长(小于0.5 / SPL MU / M)技术,新的物理现象开始出现并通过ASIC单元延迟地占据延迟。随着延误变得较小,应用的整体性能增加,重点是延迟计算精度增加。作者展示了0.5- / SPL MU / M CMOS延迟相关的物理现象,例如耦合和屏蔽效果。它们展示了这些组件如何影响单元格和互连延迟。讨论了这些物理现象对CAD技术的影响。描述了0.5- / SPL MU / M CMOS ASIC技术的延迟模型。该模型考虑了以下项目:独特的0.5微米物理现象;优化ASIC文库细胞特征时间;延迟计算器CAD工具的速度;互连提取和计算精度的要求;以及模型的可扩展性和灵活性,为未来的硅技术提供额外的准确性。

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