A Silicon interposer BGA package with Cu-filled TSV and multi-layer Cu-plating interconnect

摘要

A novel silicon interposer (SilP) BGA package (PKG) -^sSilP PKG - has been developed and qualified through test chip. It features three key process technologies; Cu-filled through Si via (TSV), fine pitch multi-layer wiring with Cu- plating, and micro-bump