首页> 外文会议>Integrated Reliability Workshop Final Report, 2004 IEEE International >Modelling charge to breakdown using hydrogen multivibrational excitation (thin SiO2 and high-k dielectrics) MOS devices
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Modelling charge to breakdown using hydrogen multivibrational excitation (thin SiO2 and high-k dielectrics) MOS devices

机译:使用氢多振动激发(薄的SiO 2 和高k电介质)对击穿电荷进行建模MOS器件

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Gate oxide breakdown in MOS devices is related to the generation of defects in the oxide bulk. Recently, the power-law dependence of charge to breakdown and time to breakdown have been proposed. In previous work, we demonstrated a current dependence of the defect generation probability of hydrogen release, and, based on this phenomenon, we have proposed a new quantitative hydrogen release model explaining all breakdown dependences with voltage for all stress polarizations for PMOS and NMOS devices. In this work, we identify two interface state generation modes. We demonstrate that one of them is the MVHR (multi-vibrational hydrogen release) and we model it.
机译:MOS器件中的栅极氧化物击穿与氧化物块中缺陷的产生有关。最近,已经提出了电荷对击穿的功率定律依赖性和击穿时间的依赖性。在先前的工作中,我们证明了氢释放缺陷产生概率的电流依赖性,并且基于此现象,我们提出了一种新的定量氢释放模型,该模型解释了PMOS和NMOS器件所有应力极化的所有击穿依赖性与电压的关系。在这项工作中,我们确定了两种接口状态生成模式。我们证明了其中之一是MVHR(多振动氢释放),并对其进行了建模。

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