Effects of Dielectric Material, Aspect Ratio and Copper Plating on Microvia Reliability

摘要

This paper documents test data on the effects of materials and processes on microvia structures. Thirteen sets ofexperiments were carried out to evaluate the effects of dielectric material, aspect ratio, via morphology, surfacepreparation, temperature and copper plating type and thickness on microvia reliability. Reliability was assessed bysubjecting boards and coupons to thermomechanical stress using four test methods: hot oil immersion, thermal shock,oven reflow simulation and Interconnect Stress Test (IST).