Effects of Dielectric Material, Aspect Ratio and Copper Plating on Microvia Reliability

摘要

This paper documents test data on the effects of materials and processes on microvia structures. Thirteen sets of experiments were carried out to evaluate the effects of dielectric material, aspect ratio, via morphology, surface preparation, temperature and copper plating type and thickness on microvia reliability. Reliability was assessed by subjecting boards and coupons to thermomechanical stress using four test methods: hot oil immersion, thermal shock, oven reflow simulation and Interconnect Stress Test (IST).