首页> 外文会议>Electronic Components and Technology Conference, 1991. Proceedings., 41st >Investigation of the adhesion mechanism of NiCr layers on Al2O3 and AlN substrates
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Investigation of the adhesion mechanism of NiCr layers on Al2O3 and AlN substrates

机译:NiCr层在Al 2上的附着机理研究 O 3 和AlN衬底

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Sputtered NiCr layers on Al2O3 and AlNsubstrates show a very high adhesive strength in pull tests. An effortwas made to investigate, with analytical procedures, the adhesionmechanism responsible for this. For the characterization of the surfacesand layers, element analyses were carried out with X-ray photoelectronspectroscopy and Auger electron spectroscopy. High-resolutiontransmission electron microscopy (HRTEM) studies were performed on aqualitative basis in order to obtain lattice fringes and lattice imagesof the thin overlayer and the substrate in near-interface regions. Theresults obtained lead to the conclusion that, with both ceramics, thegood adhesion is due to the chemical bonding between Cr, Al, and O
机译:在Al 2 O 3 和AlN上溅射NiCr层 基材在拉力测试中显示出非常高的粘合强度。努力 用分析程序研究了附着力 对此负责的机制。用于表面表征 和层,用X射线光电子进行元素分析 光谱学和俄歇电子能谱学。高分辨率 透射电子显微镜(HRTEM)研究在 定性基础以获得晶格条纹和晶格图像 界面附近区域中的薄覆盖层和基板的厚度。这 获得的结果得出结论,对于两种陶瓷, 良好的附着力归因于Cr,Al和O之间的化学键合

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