Microelectronics packaging processing using focused high powerelectron beams

摘要

It has been demonstrated that focused high-power electron beamsare alternatives for patterning next-generation multilayer ceramicpackaging. The advantages of using high-power electron beams includehigh resolution, flexibility, and direct write capability.Higher-density packages can be fabricated using this process tooltechnology. Electron beams are software-driven. Quick turnaround timecan be accomplished for customized packaging circuit designs. Electronbeams can efficiently transfer energy to thermally remove ceramicgreen-sheet materials. Electron-beam machining of ceramic green sheetshas been investigated. Experimental results indicate small-size and/orhigh density via holes can be generated. It is demonstrated that linepatterns can be delineated