Study of reliability and process ability for preset underfill sheetmaterial as future standard flip chip packaging process

摘要

Process technology in flip chip assembly is an important factor inconsidering the package reliability, cost reduction and stability ofmass production. A novel flip chip packaging technology usingnon-conductive underfill resin sheet was developed. This new technologyis no-flux flip chip packaging technology which eliminates the fluxapplying and cleaning process in current liquid underfill resin withdispensing system. It has a lot of potential to make the packagingprocess simpler and reduce handling difficulty compared with liquidunderfill dispensing process. Additionally, it makes moisture relatedreliability performance higher because this underfill resin sheetintroduces an epoxy resin with phenol curing system. In this paper, westudied the process ability and reliability on two kinds of packagingprocesses with non-conductive underfill resin sheets. The higher stressreliability and productivity was shown with the proper underfill resincomponent and packaging process