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Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th

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1.Meeting the heat removal requirements of `tiled' compliant waferlevel packages

机译：满足“平铺”晶圆的散热要求水平包
- 作者：Patel C.S.;Agraharam S.;Martin K.;Meindll J.D.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
2.Study on metal adhesion mechanisms in high density interconnectprinted circuit boards

机译：高密度互连中金属粘附机理的研究印刷电路板
- 作者：Martin L.J.;Wong C.P.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
3.Thermal and mechanical characterization of ViaLux(TM) 81: a novelepoxy photo-dielectric dry film (PDDF) for microvia applications

机译：ViaLux™81的热和机械特性：一种新颖的用于微孔应用的环氧光电介质干膜（PDDF）
- 作者：Dunne R.C.;Sitaraman S.K.;Luo S.;Wong C.P.;Estes W.E.;Periyasamy M.;Coburn J.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
4.Analytical model to study interfacial delamination propagation in amulti-layered electronic packaging structure under thermal loading

机译：分析模型的界面分层扩展的解析模型热负荷下的多层电子封装结构
- 作者：Hu H.;Xie W.;Sitaraman S.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
5.Missing solder ball failure mechanisms in plastic ball grid arraypackages

机译：塑料球栅阵列中缺少焊球故障机制包装
- 作者：Zhong C.H.;Yi S.;Mui Y.C.;Howe C.P.;Olsen D.;Chen W.T.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
6.New CBGA package with improved 2^nd level reliability

机译：新的CBGA封装具有更高的2 ^{nd 级可靠性}
- 作者：Pendse R.;Afshari B.;Butel N.;Leibovitz J.;Hosoi Y.;Shimada M.;Maeda K.;Maeda M.;Yonekura H.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
7.Current progress of advanced high speed parallel optical links forcomputer clusters and switching systems

机译：先进的高速并行光链路的最新进展计算机集群和交换系统
- 作者：Drogemuller K.;Kuhl D.;Blank J.;Ehlert M.;Kracker T.;Hohn J.;Klix D.;Plickert V.;Melchior L.;Schmale I.;Hildebrandt P.;Heinemann M.;Schiefelbein F.P.;Leininger L.;Wolf H.-D.;Wipiejewski T.;Ebberg A.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
8.An integrated process modeling methodology and module forsequential multi-layered substrate fabrication using a coupledcure-thermal-stress analysis approach

机译：集成的过程建模方法和模块使用耦合的顺序多层基板制造固化热应力分析方法
- 作者：Dunne R.C.;Sitaraman S.K.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
9.Numerical and experimental investigations of large IC flip chipattach

机译：大型IC倒装芯片的数值和实验研究连接
- 作者：Schubert A.;Dudek R.;Leutenbauer R.;Coskina P.;Becker K.-F.;Kloeser J.;Michel B.;Reichl H.;Baldwin D.;Qu J.;Sitaraman S.;Wong C.P.;Tummala R.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
10.Solder joint crack propagation analysis of wafer-level chip scalepackage on printed circuit board assemblies

机译：晶圆级芯片规模的焊点裂纹扩展分析印刷电路板组件上的封装
- 作者：Lau J.;Chang C.;Lee S.W.R.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
11.Experimental and numerical reliability investigations of FCOBassemblies with process-induced defects

机译：FCOB的实验和数值可靠性研究具有过程引起的缺陷的组件
- 作者：Schubert A.;Dudek R.;Kloeser J.;Michel B.;Reichl H.;Hauck T.;Kaskoun K.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
12.Physics based modeling of simultaneous switching noise in highspeed systems

机译：基于物理的高通量同时开关噪声建模速度系统
- 作者：Sungjun Chun;Swaminathan M.;Smith L.D.;Srinivasan J.;Zhang Jin;Iyer M.K.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
13.Effect of simulation methodology on solder joint crack growthcorrelation

机译：模拟方法对焊点裂纹扩展的影响相关性
- 作者：Darveaux R.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
14.The viability of anisotropic conductive film (ACF) as a flip chipinterconnection technology

机译：各向异性导电膜（ACF）作为倒装芯片的可行性互连技术
- 作者：Kim K.M.;Kim J.O.;Kim S.G.;Lee K.H.;Chen A.S.;Ahmad N.;Dugbartey N.;Karnezos M.;Tam S.;Kweon Y.D.;Pendse R.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
15.A reliability and failure mode analysis of no flow underfillmaterials for low cost flip chip assembly

机译：无流动填充不足的可靠性和失效模式分析低成本倒装芯片组装材料
- 作者：Smith B.S.;Thorpe R.;Baldwin D.F.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
16.Modeling and simulation of the dynamic response of the electronicpackaging

机译：电子动态响应的建模与仿真打包
- 作者：He X.;Fulton R.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
17.A study on reliability modeling for through hole cracking failurein thermal enhanced PBGA laminate

机译：通孔裂纹失效可靠性建模研究增强型PBGA层压板
- 作者：Kobayashi T.;Hayashida S.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
18.Fab Integrated Packaging (FIP): a new concept for high reliabilitywafer-level chip size packaging

机译：晶圆厂集成包装（FIP）：高可靠性的新概念晶圆级芯片尺寸封装
- 作者：Topper M.;Auersperg J.;Glaw V.;Kaskoun K.;Prack E.;Keser B.;Coskina P.;Jager D.;Fetter D.;Ehrmann O.;Samulewicz K.;Meinherz C.;Fehlberg S.;Karduck C.;Reichl H.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
19.Thermal characterization of electronic components using a newhigh-resolution simulation tool

机译：使用新的电子元件热特性高分辨率仿真工具
- 作者：Hanreich G.;Nicolics J.;Hauser H.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
20.A novel method and device for solder joint quality inspection byusing laser ultrasound

机译：一种新的焊点质量检验方法和装置使用激光超声
- 作者：Sheng Liu;Erdahl D.;Ume C.;Achari A.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
21.Electrical characteristics of an ACF bond as a function oftemperature and humidity aging

机译：ACF键的电气特性随温湿度老化
- 作者：Weidler J.D.;Burg R.D.;Decker J.J.;Constable J.H.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
22.A new high strength copper-tin-zinc alloy for connectors and otherconductive springs

机译：新型高强度铜锡锌合金，用于连接器和其他导电弹簧
- 作者：Bhargava A.K.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
23.A new method for comparing migration abilities of conductor systemsbased on conventional electroanalytical techniques

机译：一种比较导体系统迁移能力的新方法基于常规的电分析技术
- 作者：Harsanyi G.;Inzelt G.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
24.Single mode fiber MT-RJ SFF transceiver module using optical subassembly with a new shielded silicon optical bench

机译：使用光学子模块的单模光纤MT-RJ SFF收发器模块用新的屏蔽硅光学平台进行组装
- 作者：Iwase M.;Nomura T.;Izawa A.;Mori H.;Tamura S.;Shirai T.;Kamiya T.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
25.The influence of room temperature aging on ball shear strength andmicrostructure of area array solder balls

机译：室温时效对球体抗剪强度和强度的影响面阵焊球的微观结构
- 作者：Coyle R.J.;Solan P.P.;Serafino A.J.;Gahr S.A.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
26.Effect of package design and layout on BGA solder joint reliabilityof an organic C4 package

机译：封装设计和布局对BGA焊点可靠性的影响有机C4封装
- 作者：Chandran B.;Goyal D.;Thomas J.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
27.High performance selectively oxidized VCSELs and arrays forparallel high-speed optical interconnects

机译：高性能选择性氧化VCSEL和阵列，用于并行高速光互连
- 作者：Mederer F.;Grabherr M.;Eberhard F.;Ecker I.;Jager R.;Joos J.;Jung C.;Kicherer M.;King R.;Schnitzer P.;Unold H.;Wiedenmann D.;Ebeling K.J.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
28.Understanding the process window for printing lead-free solderpastes

机译：了解印刷无铅焊料的工艺窗口糊状
- 作者：Nguty T.A.;Budiman S.;Rajkumar D.;Solomon R.;Ekere N.N.;Currie M.A.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
29.Challenges in interconnection and packaging ofmicroelectromechanical systems (MEMS)

机译：互连和封装方面的挑战微机电系统（MEMS）
- 作者：Ramesham R.;Ghaffarian R.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
30.Fabrication of silicon-on-reflector for Si-basedresonant-cavity-enhanced photodetectors

机译：硅基反射硅的制作共振腔增强光电探测器
- 作者：Cheng Li;Qinqing Yang;Haiyan Ou;Qiming Wang
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
31.Lens-less semiconductor optical amplifier (SOA) modules using laserwelding techniques

机译：使用激光的无透镜半导体光放大器（SOA）模块焊接技术
- 作者：Park M.W.;Kim J.R.;Park S.;Lee J.S.;Kim H.I.;Choo A.G.;Kim T.I.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
32.Complex ultrasound emitter and micro-wave irradiator forinner-cavity action

机译：复合超声发射器和微波辐射用于内腔动作
- 作者：Belavskay S.V.;Vityugov V.A.;Adoniev V.G.;Lisitsyna I.I.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
33.Investigation of under bump metallization systems for flip-chipassemblies

机译：倒装芯片下凸点金属化系统的研究组件
- 作者：Poi Siong Teo;Yu-Wen Huang;Chih Hang Tung;Marks M.R.;Thiam Beng Lim
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
34.Author Index

机译：作者索引
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
35.Investigation on effect of coupling agents in epoxy based underfillmaterial for flip chip application

机译：偶联剂在环氧树脂基底部填充胶中的作用研究倒装芯片应用材料
- 作者：Shijian Luo;Wong C.P.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
36.A web based course on designing high density interconnect PCBs formanufacturability

机译：基于Web的课程，有关设计用于以下用途的高密度互连PCB可制造性
- 作者：Ananda Rao G.;Rao N.J.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
37.A measurement and simulation study of transmission lines onmicrostrip and stacked-pair structure for high speed signals

机译：输电线路的测量与仿真研究。微带和堆叠对结构，用于高速信号
- 作者：Odate Y.;Usami T.;Otsuka K.;Suga T.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
38.Discretely tunable multi cavity FFP filter for standard WDMfrequency grid

机译：适用于标准WDM的离散可调多腔FFP滤波器频率网格
- 作者：Lamperski J.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
39.Screen printing, placement and joining technologies with lead-freejoining materials

机译：丝网印刷，贴装和连接技术无铅连接材料
- 作者：Detert M.;Herzog T.;Wolter K.-J.;Zerna T.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
40.Novel jet fluxing application for advanced flip chip and BGA/CGApackages

机译：适用于先进倒装芯片和BGA / CGA的新型喷射助焊剂应用包装
- 作者：Master R.N.;Dubey A.;Guardado M.;Ong O.T.;Donges B.;Okada F.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
41.Distance learning in thermal design of electronic systems - theIEEE/NSF project

机译：电子系统热设计中的远程学习-IEEE / NSF项目
- 作者：Joshi Y.;Sircar J.K.;Bar-Cohen A.;Bhavnani S.;Barnes J.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
42.Study of reliability and process ability for preset underfill sheetmaterial as future standard flip chip packaging process

机译：预设底部填充纸的可靠性和处理能力的研究材料作为未来的标准倒装芯片封装工艺
- 作者：Noro H.;Mizutani M.;Kuwamura M.;Usui H.;Ito S.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
43.Development of a wafer-level burn-in test socket for fine-pitch BGAinterconnect

机译：开发用于微间距BGA的晶圆级老化测试插座相互联系
- 作者：Qiao Q.;Gordon M.H.;Schmidt W.F.;Li L.;Ang S.S.;Huang B.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
44.High-frequency electrical performance of a new high-densitymultiple line grid array (MLGA) package

机译：新型高密度高频电气性能多线网格阵列（MLGA）封装
- 作者：Seungyoung Ahn;Joon-Woo Lee;Jonghoon Kim;Woongwhan Ryu;Young-Soo Kim;Yoon C.K.;Joungho Kim
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
45.Characterization of a novel fine-pitch ball grid array package forflash memory application

机译：新型细间距球栅阵列封装的特性闪存应用
- 作者：Sidharth;Valluri V.;Gannamani R.;Meilu Zhang
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
46.LOC tape design for protecting integrated circuit pattern fromdamage due to a dicing saw blade

机译：LOC胶带设计可保护集成电路图案免受划片锯造成的损坏
- 作者：Seong-Min Lee
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
47.Fiber-optic pigtail assembly and attachment alignment shift using alow-cost robotic platform

机译：光纤尾纤的装配和附件对准使用低成本机器人平台
- 作者：Witham C.R.;Beranek M.W.;Carlisle B.R.;Chan E.Y.;Koshinz D.G.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
48.A low-cost and high-density RF multi-chip module transceiver for1.8-GHz personal communication service

机译：一种低成本，高密度的RF多芯片模块收发器，用于1.8 GHz个人通讯服务
- 作者：Woonghwan Ryu;Jonghoon Kim;Namhoon Kim;Hyungsoo Kim;Seungyoung Ahn;Sungil Kim;HIangok Song;Seungho Lee;Joungho Kim
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
49.Flip chip assembly utilizing anisotropic conductive films: afeasibility study

机译：利用各向异性导电膜的倒装芯片组装：可行性研究
- 作者：Delaney D.;White J.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
50.Electromagnetic radiation and simultaneous switching noise in aCMOS device packaging

机译：电磁辐射和同时开关噪声CMOS器件封装
- 作者：Sudo T.;Ko Y.;Sakaguchi S.;Tokumaru T.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
51.Manufacturing productivity improvements for PBGA and flip chipsubstrates in PWB factory

机译：PBGA和倒装芯片的生产效率提高PWB工厂中的基材
- 作者：Chrzanowski D.E.;Stanke D.A.;Lapcevich R.A.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
52.Development of conductive adhesive materials for via fillapplications

机译：开发用于通孔填充的导电胶材料应用领域
- 作者：Kang S.K.;Buchwalter S.;LaBianca N.;Gelorme J.;Purushothaman S.;Papathomas K.;Poliks M.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
53.Novel high dielectric constant nano-structure polymer-ceramiccomposite for embedded capacitor application

机译：新型高介电常数纳米结构聚合物陶瓷用于嵌入式电容器的复合材料
- 作者：Yang Rao;Ogitani S.;Kohl P.;Wong C.P.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
54.Flip chip processing of lead-free solders and halogen-free highdensity microvia substrates

机译：倒装芯片加工无铅焊料和无卤高密度微孔基板
- 作者：Baynham G.;Baldwin D.F.;Boustedt K.;Johansson A.;Wennerholm C.;Patterson D.;Elenius P.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
55.High frequency/high density build-up boards with benzocyclobuteneBCB polymer coated Cu foil

机译：带有苯并环丁烯的高频/高密度积木板BCB聚合物涂层铜箔
- 作者：Garrou P.;So Y.;Im J.;Ohba K.;Akimoto H.;Kohno M.;Shimoto T.;Matsui K.;Shimada Y.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
56.Special characteristic of future flip chip underfill materials andthe process

机译：未来倒装芯片底部填充材料和过程
- 作者：Usui H.;Mizutani M.;Noro H.;Kuwamura M.;Kuroyanagi A.;Ito H.;Harada T.;Ito S.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
57.An all purpose dispersive multiconductor interconnect modelcompatible with PRIMA

机译：通用色散多导体互连模型与PRIMA兼容
- 作者：Pasha S.;Cangellaris A.C.;Prince J.L.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
58.Predictive reliability modeling for flipchip interconnect bumpextrusion

机译：倒装芯片互连凸点的预测可靠性建模挤压
- 作者：Lucero A.E.;Dias R.;Pavey T.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
59.One micron precision, wafer-level aligned bonding for interconnect,MEMS and packaging applications

机译：1微米精度的晶圆级对准键合，用于互连，MEMS和封装应用
- 作者：Mirza A.R.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
60.Gold-aluminum wirebond interface testing using laser-inducedultrasonic energy

机译：使用激光诱导的金铝丝焊界面测试超声波能量
- 作者：Romenesko B.M.;Charles H.K. Jr.;Cristion J.A.;Siu B.K.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
61.Investigation of high reliability micro bump plating technique ontape carrier

机译：高可靠性微凸点电镀工艺研究。载带
- 作者：Chinda A.;Matsuura A.;Yoshioka O.;Mita M.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
62.Automation manufacturing systems technology for opto-electronicdevice packaging

机译：光电自动化制造系统技术设备包装
- 作者：Soon Jang
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
63.Conduction development in electrically conductive adhesives with abimodal size distributed conducting and inert particles: effect ofpolydispersity

机译：导电胶的导电发展双峰分布的导电和惰性粒子的大小：多分散性
- 作者：Mikrajuddin;Shi F.G.;Okuyama K.;Kim H.K.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
64.Epoxy adhesives for optical element attachment in planar passiveoptical components

机译：平面无源光学元件附着用环氧树脂胶光学元件
- 作者：Liu J.G.;Andersen B.M.;Bergmann E.E.;Fairchild S.K.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
65.The first entrepreneurial and practice-oriented masters program inmicroelectronics systems packaging

机译：第一个创业和以实践为导向的硕士课程微电子系统包装
- 作者：Conrad L.;Tummala R.;May G.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
66.New course development in electronic products and systems costanalysis

机译：电子产品和系统成本的新课程开发分析
- 作者：Sandborn P.;Allen D.T.;Murphy C.F.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
67.Comparison of flip chip technologies on rigid polyimide withrespect to reliability and manufacturing costs

机译：刚性聚酰亚胺与倒装芯片技术的比较关于可靠性和制造成本
- 作者：Miessner R.;Aschenbrenner R.;Reichi H.;Ling S.;Binh Le;Lew A.;Benson R.;Nhan E.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
68.System level packaging of high density optoelectronicinterconnections

机译：高密度光电系统级封装相互联系
- 作者：Nyquist J.S.;Sherman C.J.;Grimes G.J.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
69.Solder joint shape formation under constrained boundaries in waferlevel underfill

机译：晶圆约束边界下的焊点形状形成水平填充
- 作者：Nguyen L.;Nguyen H.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
70.Effects of lead bonding process on reliability of chip scalepackage

机译：引线键合工艺对芯片尺寸可靠性的影响包
- 作者：Lee Y.J.;Eyre M.W.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
71.Chip scale polymer stud grid array packaging and reliability basedon low cost flip chip processing

机译：芯片级聚合物螺柱网格阵列封装和基于可靠性低成本倒装芯片处理
- 作者：Paydenkar C.S.;Baldwin D.F.;Sitaraman S.;Wong C.P.;Lewis B.J.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
72.Applications of newly developed positive photosensitive blockco-polyimides to CSPs

机译：新开发的正型感光块的应用CSP的共聚酰亚胺
- 作者：Matsumoto S.;Jin X.Z.;Fukushima T.;Uemura T.;Itatani H.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
73.Endoscopic inspection of solder joint integrity in chip scalepackages

机译：内窥镜检查芯片级焊点完整性包装
- 作者：Chan Y.C.;Tang C.W.;Tu P.L.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
74.Advances in multi-channel optical multi-gbytes/sec bit-parallel WDMsingle fiber link

机译：多通道光学千兆字节/秒位并行WDM的进展单纤链路
- 作者：Bergman L.A.;Yeh C.;Morookian J.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
75.An innovative flexible and accurate packaging technique suited tofabricate low cost micro optoelectronic modules

机译：创新的灵活，准确的包装技术，适用于制造低成本的微型光电模块
- 作者：Scussat M.;Wursch A.;Clavel R.;Salathe R.P.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
76.Flip chip interconnect systems using wire stud bumps and lead freesolder

机译：使用线头凸点和无铅倒装芯片互连系统焊接
- 作者：Zama S.;Baldwin D.F.;Hikami T.;Murata H.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
77.Packaging aspects of the LitebusTM paralleloptoelectronic module

机译：Litebus TM 并行的包装方面光电模块
- 作者：Freitag L.;Kuczynski J.;Fortier P.;Guindon F.;Letourneau M.;Chan B.;Sherman J.;Johnson G.;Demangone D.;Mentzer M.;Naghski D.;Trostle B.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
78.Single level integrated packaging modules for high performanceelectronic systems

机译：单级集成包装模块可实现高性能电子系统
- 作者：Li-Rong Zheng;Tenhunen H.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
79.Novel die attach films having high reliability performance forlead-free solder and CSP

机译：具有高可靠性的新型芯片贴膜无铅焊料和CSP
- 作者：Takeda S.;Masuko T.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
80.Warpage studies of HDI test vehicles during various thermalprofiling

机译：HDI测试车辆在各种温度下的翘曲研究剖析
- 作者：Petriccione G.J.;Ume I.C.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
81.Fine pitch probing and wirebonding and reliability of aluminumcapped copper bond pads

机译：铝的细间距探测和引线键合以及可靠性封盖的铜焊盘
- 作者：Tran T.A.;Yong L.;Williams B.;Chen S.;Chen A.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
82.CSP assembly reliability and effects of underfill and double-sidedpopulation

机译：CSP组件的可靠性以及底部填充和双面填充的影响人口
- 作者：Ghaffarian R.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
83.Characterization of low alpha emissivity system on electroplatedsolder bumps

机译：电镀后低α发射率系统的表征锡球
- 作者：Mistry A.;Lee S.;Enman C.;Carroll B.;Mitchell D.;Mathew V.;Weeks D.;Tucker M.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
84.Effect of non-conducting filler additions on anisotropic conductiveadhesives (ACAs) properties and the reliability of ACAs flip chip onorganic substrates

机译：非导电填料的添加对各向异性导电的影响胶粘剂（ACA）的性能和ACA倒装芯片的可靠性有机底物
- 作者：Hilyung-Jin Yim;Kyung-Wook Paik
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
85.Evaluation and characterization of high-performance fillingencapsulants for system chips application

机译：高性能灌装的评估和表征用于系统芯片的密封剂
- 作者：Jiali Wu;Bhattacharya S.K.;Wong M.;Lloyd C.;Tummala R.R.;Wong C.P.;Pogge H.B.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
86.Assembly and solder joint reliability of plastic ball grid arraywith lead-free versus lead-tin interconnect

机译：塑料球栅阵列的组装和焊点可靠性无铅与铅锡互连
- 作者：Levis K.-M.;Mawer A.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
87.Curriculum restructure to answer critical needs in packaging forenergy efficiency/renewable energy systems, wireless, and mixed-signalsystems areas

机译：课程结构调整以满足包装中的关键需求能源效率/可再生能源系统，无线和混合信号系统领域
- 作者：Brown W.;Elshabini A.;Ang S.;Balda J.;Barlow F.;Coubillion R.;Malshe A.;Malstrom R.;Mantooth A.;Martin T.;Naseem H.;Jones R.;Waite W.;Brown R.;Schmitt N.;Nutter D.;Salamo G.;Schaper L.;Schmidt W.;Selvam R.;Singh S.;Olejniczak K.;Ulrich R.;Yeargan J.;Yaz E.;White W.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
88.Vibration fatigue of μBGA solder joint

机译：μBGA焊点的振动疲劳
- 作者：Tu P.L.;Chan Y.C.;Tang C.W.;Lai J.K.L.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
89.New evaluation method of CSPs board level reliability using straingauge

机译：基于应变的CSP板级可靠性评估新方法测量
- 作者：Yamaji Y.;Suzuki T.;Yamasaki H.;Ohishi T.;Chikawa Y.;Kako N.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
90.Extensive fatigue investigation of solder joints in IGBT high powermodules

机译：IGBT大功率焊点的广泛疲劳研究模组
- 作者：Thebaud J.-M.;Woirgard E.;Zardini C.;Sommer K.-H.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
91.Intermetallic phase formation and growth kinetics at the interfacebetween molten solder and Ni-containing under bump metallization

机译：界面金属间相的形成和生长动力学凸点金属化下熔融焊料与含镍之间
- 作者：Su P.;Korhonen T.;Korhonen M.;Li C.-Y.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
92.Network analyzer calibration methods for high-density packagingcharacterization and validation of simulation models

机译：用于高密度包装的网络分析仪校准方法仿真模型的表征和验证
- 作者：Hammond C.L.;Virga K.L.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
93.Development of an etchant for selectively etching TiWN_xin the presence of electroplated 95Pb-5Sn solder

机译：选择性刻蚀TiWN _{x 的刻蚀剂的开发在电镀的95％Pb-5％Sn焊料中}
- 作者：Ramanathan L.N.;Mitchell D.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
94.Statistical analysis of embedded capacitors using Monte Carlosimulation

机译：使用蒙特卡洛的嵌入式电容器的统计分析模拟
- 作者：Carastro L.;Ilgu Yun;Poddar R.;Brooke M.;May G.S.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
95.Analysis of alignment tolerant hybrid optoelectronic receivers forhigh density interconnection substrates

机译：面向对准的混合光电接收机的分析。高密度互连基板
- 作者：Vrazel M.;Chang J.J.;Brooke M.;Jokerst N.M.;Youngjoong Joe;Carastro L.;Dagnall G.;Brown A.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
96.Chip-scale packaging of power devices and its application inintegrated power electronics modules

机译：功率器件的芯片级封装及其应用集成电力电子模块
- 作者：Xingsheng Liu;Xiukuan Jing;Guo-Quan Lu
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
97.Hybrid assembly technology for flip-chip-on-chip (FCOC) using PBGAlaminate assembly

机译：使用PBGA的倒装芯片级芯片（FCOC）的混合组装技术层压板组件
- 作者：Dufresne J.;Ouimet S.;Homa T.R.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
98.Interface adhesion between copper lead frame and epoxy mouldingcompound: effects of surface finish, oxidation and dimples

机译：铜引线框架与环氧树脂成型件之间的界面粘合化合物：表面光洁度，氧化和酒窝的影响
- 作者：Jang-Kyo Kim;Lebbaj M.;Liu J.H.;Ji Hoon Kim;Yuen M.M.F.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
99.Processability and reliability of commercial palladium platedstructures

机译：商业镀钯的可加工性和可靠性结构
- 作者：Chan K.C.;Chai T.C.;Yang Y.Z.;Gopalalaishan R.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》
100.Self-organizing waveguide coupling method “SOLNET” andits application to film optical circuit substrates

机译：自组织波导耦合方法“ SOLNET”和在薄膜光学电路基板中的应用
- 作者：Yoshimura T.;Roman J.;Takahashi Y.;Wang W.-C.V.;Inao M.;Ishitsuka T.;Tsukamoto K.;Aoki S.;Motoyoshi K.;Sotoyama W.
- 会议名称：《Electronic Components amp; Technology Conference, 2000. 2000 Proceedings. 50th》