首页>
外国专利>
A PROCESS FOR UNDERFILLING FLIP-CHIP INTEGRATED CIRCUIT PACKAGE WITH AN UNDERFILL MATERIAL THAT IS HEATED TO A PARTIAL GEL STATE
A PROCESS FOR UNDERFILLING FLIP-CHIP INTEGRATED CIRCUIT PACKAGE WITH AN UNDERFILL MATERIAL THAT IS HEATED TO A PARTIAL GEL STATE
展开▼
机译:用加热到部分凝胶态的未填充材料对倒装芯片集成电路包进行未填充的过程
展开▼
页面导航
摘要
著录项
相似文献
摘要
A partial gel step in the underfilling of an integrated circuit that is mounted to a substrate. The process involves dispensing a first underfill material and then heating the underfill material to a partial gel state. The partial gel step may reduce void formation and improve adhesion performance during moisture loading.
展开▼