Challenges in interconnection and packaging ofmicroelectromechanical systems (MEMS)

摘要

Integrated circuit packaging and their testing is well advancedbecause of the maturity of the IC industry, their wide applications, andavailability of industrial infrastructure. This is not true for MEMSwith respect to packaging and testing. It is more difficult to adoptstandardized MEMS device packaging for wide applications although MEMSuse many similar technologies to IC packaging. Packaging of MEMS devicesis more complex since in some cases it needs to provide protection fromthe environment while in some cases allowing access to the environmentto measure or affect the desired physical or chemical parameters.Microscopic mechanical moving parts of MEMS have also their uniqueissues. Therefore, testing MEMS packages using the same methodologies,as those for electronics packages with standard procedures might notalways be possible especially when quality and reliability need to beassessed. Single MEMS chip packaging approaches and their limitations inthe packaging of high performance MEMS will be reviewed in thispresentation and also identifies a need for a systematic approach forthis purpose. MEMS package reliability depends on package type, i.e.ceramic, plastic, or metal, and reliability of device. The MEMS devicereliability depends on its materials and wafer level processes andsealing methods used for environmental protection. MEMS quality andreliability challenges are discussed and needs for study in these areasare identified