Manufacturing Transition of High-Performance MEMS Gyroscopes

摘要

We present the progress of a high-performance inertial sensor manufacturing processes implemented in a volume compatible 200mm wafer diameter production environment. The baseline process, derived from Teledyne DALSA's MIDIS™ process platform, incorporates critical design elements specifically designed for navigation-grade device realization. The process enables considerable flexibility to support a broad range of device designs, facilitating the rapid transition of new device concepts to volume production. The recent work for the Si Disc Resonator Gyro (SiDRG) demonstrates the integration of die-level thermal stabilization elements and the manufacturing at high yield of wafer-level vacuum packaged gyro resonators with high quality factor and small frequency splits. Initial measurement of Allen Deviation on unscreened parts has shown promising performance levels of 0.028 degrees/hour.