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Threshold Voltage Instability of Commercial 1.2 kV SiC Power MOSFETs

机译:商用1.2 kV SiC功率MOSFET的阈值电压不稳定性

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This paper presents threshold voltage instability of commercially available 1.2 kV SiC power MOSFETs from multiple vendors. Time-dependent bias-stress measurements are implemented to define the threshold voltage change incurred by near interface oxide traps. Bias-stress on the gate gives rise to injection of carriers into the gate oxide by direct tunneling to the near interface traps. Positive gate bias tends to increase threshold, whereas, negative gate bias tends to decrease threshold voltage. Threshold voltage shifts for various vendors vary from 0.15 V to 0.74 V under bias-stress of +30 V, and −0.05 V to −0.2 V under bias-stress of −10 V for 50 hours. This wide variation in the shifts between vendors indicates the different trap distribution in their oxides. In general, a positive threshold voltage shift decreases current drive, while a negative shift can cause the device to move into an ON state. However, the shift by itself does not represent an operational problem in power electronics but signifies the high density of defects in the gate oxide which may have significance for useful lifetime of gate oxides.
机译:本文介绍了来自多家供应商的商用1.2 kV SiC功率MOSFET的阈值电压不稳定性。实施随时间变化的偏置应力测量,以定义由近界面氧化物陷阱引起的阈值电压变化。栅极上的偏压应力通过直接隧穿到附近的界面陷阱而将载流子注入到栅极氧化物中。正栅极偏压倾向于增加阈值,而负栅极偏压倾向于降低阈值电压。在+30 V的偏置压力下,各种供应商的阈值电压变化范围从0.15 V到0.74 V,在-10 V的偏置压力下持续50小时,其阈值电压变化在-0.05 V到-0.2 V之间。供应商之间转移的广泛变化表明其氧化物中的陷阱分布不同。通常,正阈值电压偏移会降低电流驱动,而负偏移会导致器件进入导通状态。然而,这种移动本身并不代表功率电子学中的操作问题,而是表示栅极氧化物中缺陷的高密度,这对于栅极氧化物的使用寿命可能具有重要意义。

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