首页> 中文期刊> 《纳米技术与精密工程(英文)》 >Determination of failure degree of 1.2 kV SiC MOSFETs after short-circuit test using an improved test setup

Determination of failure degree of 1.2 kV SiC MOSFETs after short-circuit test using an improved test setup

         

摘要

Analysis of the short-circuit characteristics of SiC metal-oxide-semiconductor field-effect transistors(MOSFETs)is very important for their practical application.This paper studies the SiC MOSFET short-circuit characteristics with an improved test setup under different conditions.A high-current Si insulated gate bipolar transistor is used as a circuit breaker in the test circuit rather than the usual short-circuit test conducted without a circuit breaker.The test platform with a circuit breaker does not influence the calculation results regarding the shortcircuitwithstand time and energy,but the SiCMOSFETwill switch off after failure in a very short time.In addition,the degree of failure will be limited and confined to a small area,such that the damage to the chip will be clearly observable,which is significant for short-circuit failure analysis.

著录项

  • 来源
    《纳米技术与精密工程(英文)》 |2020年第4期|P.235-240|共6页
  • 作者单位

    Research and Development Department Shenzhen BASiC Semiconductor Ltd. Shenzhen 518000 China;

    Research and Development Department Shenzhen BASiC Semiconductor Ltd. Shenzhen 518000 China;

    Research and Development Department Shenzhen BASiC Semiconductor Ltd. Shenzhen 518000 China;

    Research and Development Department Shenzhen BASiC Semiconductor Ltd. Shenzhen 518000 China;

    Research and Development Department Shenzhen BASiC Semiconductor Ltd. Shenzhen 518000 China;

    Dept.Electrical Engineering Tsinghua University Beijing 100084 China;

    Research and Development Department Shenzhen BASiC Semiconductor Ltd. Shenzhen 518000 China;

  • 原文格式 PDF
  • 正文语种 chi
  • 中图分类 半导体技术;
  • 关键词

    SiC MOSFET; Short-circuit test; Failure analysis;

    机译:SIC MOSFET;短路测试;失败分析;
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