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Close-down process scheduling of wafer residence time-constrained multi-cluster tools

机译:晶圆停留时间受限制的多群集工具的关闭工艺调度

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Semiconductor manufacturing industry has adopted multi-cluster tools as wafer fabrication equipment that is extraordinarily pricey but highly attractive owing to their higher productivity than single cluster tools can achieve. A challenging issue is how to schedule these tools. It is especially difficult to schedule their frequently occurring close-down processes subject to wafer residency constraints. Such processes appear frequently as caused by wafer lot switches and preventive and emergency maintenances. They are dynamical and non-cyclic. We analyze the synchronization conditions for multiple robots to perform concurrent activities. Upon these conditions, for the situations that an optimal schedule can be found in the steady state, a linear program model is proposed to find a feasible and optimal schedule for close-down processes. An example shows the application and efficiency of our proposed method.
机译:半导体制造行业已采用多集群工具作为晶圆制造设备,该设备价格昂贵,但由于其生产率高于单个集群工具可达到的生产率而极具吸引力。一个具有挑战性的问题是如何安排这些工具。受晶圆驻留限制的约束,很难安排其经常发生的关闭过程。由于晶圆批次切换以及预防和紧急维护,这些过程经常出现。它们是动态的和非周期性的。我们分析了多个机器人执行并发活动的同步条件。在这些条件下,针对可以在稳态下找到最佳计划表的情况,提出了一种线性程序模型来为关闭过程找到可行和最佳的计划表。一个例子说明了我们提出的方法的应用和效率。

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