Optimal integrated schedule of entire process of dual-blade multi-cluster tools from start-up to close-down

摘要

Multi-cluster tools are widely used in majority of wafer fabrication processes in semiconductor industry. Smaller lot production, thinner circuit width in wafers, larger wafer size, and maintenance have resulted in a large quantity of their start-up and close-down transient periods. Yet, most of existing efforts have been concentrated on scheduling their steady states. Different from such efforts, this work schedules their transient and steady-state periods subject to wafer residency constraints. It gives the schedulability conditions for the steady-state scheduling of dual-blade robotic multi-cluster tools and a corresponding algorithm for finding an optimal schedule. Based on the robot synchronization conditions, a linear program is proposed to figure out an optimal schedule for a start-up period, which ensures a tool to enter the desired optimal steady state. Another linear program is proposed to find an optimal schedule for a close-down period that evolves from the steady state period. Finally, industrial cases are presented to illustrate how the provided method outperforms the existing approach in terms of system throughput improvement.