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Modeling of crosstalk effects in carbon nanotube based differential through-silicon via array

机译:基于碳纳米管的差分硅通孔阵列中串扰效应的建模

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摘要

The equivalent circuit model of multiple differential through-silicon vias (D-TSVs) based on carbon nanotube (CNT) is presented in this paper. The model is validated against the full-wave electromagnetic simulator HFSS. By virtue of the circuit model, the crosstalk between CNT-based D-TSVs is evaluated and compared.
机译:提出了基于碳纳米管(CNT)的多个差分硅通孔(D-TSV)的等效电路模型。该模型已针对全波电磁模拟器HFSS进行了验证。借助电路模型,可以评估和比较基于CNT的D-TSV之间的串扰。

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