首页> 外文会议>IEEE Energy Conversion Congress and Exposition >Robustness in short-circuit mode: Benchmarking of 600V GaN HEMTs with power Si and SiC MOSFETs
【24h】

Robustness in short-circuit mode: Benchmarking of 600V GaN HEMTs with power Si and SiC MOSFETs

机译:短路模式下的稳健性:采用功率Si和SiC MOSFET对600V GaN HEMT进行基准测试

获取原文
获取外文期刊封面目录资料

摘要

A short-circuit e.g. in a half-bridge converter is a severe and potentially destructive operation condition for a power transistor and needs to be turned-off quickly and safely. In order to define strategies how to improve the reliability of a power device, it is necessary to understand the failure dynamics during a short-circuit. In this paper, an experimental study focussing on the short-circuit capability of different types of 600V power transistors based on Si, SiC and GaN is presented. Usually, a 10μ8 short-circuit withstand time at 400V is required for 600V power transistors. Measurement results show that the investigated Si and SiC MOSFETs can withstand short-circuit times up to 13μs at 400V and 150°C, while the normally-off and cascode GaN devices demonstrate considerably less withstand capability.
机译:短路例如在半桥转换器中,功率晶体管的工作状况非常恶劣,可能会造成破坏,因此需要快速安全地将其关断。为了定义策略来提高功率设备的可靠性,有必要了解短路期间的故障动态。在本文中,针对基于Si,SiC和GaN的不同类型的600V功率晶体管的短路能力进行了实验研究。通常,对于600V功率晶体管,在400V时需要10μ8的短路耐受时间。测量结果表明,所研究的Si和SiC MOSFET在400V和150°C下可承受高达13μs的短路时间,而常关型和共源共栅GaN器件的耐受能力要低得多。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号