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Single-phase T-type inverter performance benchmark using Si IGBTs, SiC MOSFETs and GaN HEMTs

机译:使用Si IGBT,SiC MOSFET和GaN HEMT的单相T型逆变器性能基准

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摘要

In this paper, benchmark of Si IGBT, SiC MOSFET and GaN HEMT power switches at 600V class is conducted in single-phase T-type inverter. Gate driver requirements, switching performance, inverter efficiency performance, heat sink volume, output filter volume and dead-time effect for each technology is evaluated. Gate driver study shows that GaN has the lowest gate driver losses above 100kHz and below 100kHz, SiC has lowest gate losses. GaN has the best switching performance among three technologies that allows high efficiency at high frequency applications. GaN based inverter operated at 160kHz switching frequency with 97.3% efficiency at 2.5kW output power. Performance of three device technologies at different temperature, switching frequency and load conditions shows that heat sink volume of the converter can be reduced by 2.5 times by switching from Si to GaN solution at 60°C case temperature, and for SiC and GaN, heat sink volume can be reduced by 2.36 and 4.92 times respectively by increasing heat sink temperature to 100°C. Output filter volume can be reduced by 43% with 24W, 26W and 61W increase in device power loss for GaN, SiC and Si based converters respectively. WBG devices allow reduction of harmonic distortion at output current from 3.5% to 1.5% at 100kHz.
机译:本文在单相T型逆变器中进行了600V级Si IGBT,SiC MOSFET和GaN HEMT功率开关的基准测试。评估了每种技术的栅极驱动器要求,开关性能,逆变器效率性能,散热器体积,输出滤波器体积和停滞时间效应。栅极驱动器研究表明,GaN在高于100kHz和低于100kHz时具有最低的栅极驱动器损耗,而SiC具有最低的栅极损耗。 GaN具有三项技术中最好的开关性能,可在高频应用中实现高效率。基于GaN的逆变器以160kHz的开关频率工作,在2.5kW输出功率下的效率为97.3%。三种器件技术在不同温度,开关频率和负载条件下的性能表明,通过在60°C的外壳温度下从Si转换为GaN溶液,转换器的散热器体积可减少2.5倍,而对于SiC和GaN,则可将其散热器减小通过将散热器温度提高到100°C,体积可以分别减少2.36和4.92倍。 GaN,SiC和Si基转换器的器件功耗分别增加24W,26W和61W,输出滤波器的体积可以减少43%。 WBG器件可将100kHz输出电流下的谐波失真从3.5%降低到1.5%。

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