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Hot carrier aging and its variation under use-bias: Kinetics, prediction, impact on Vdd and SRAM

机译:热载流子老化及其在使用偏置下的变化:动力学,预测,对Vdd和SRAM的影响

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As CMOS scales down, hot carrier aging (HCA) scales up and can be a limiting aging process again. This has motivated re-visiting HCA, but recent works have focused on accelerated HCA by raising stress biases and there is little information on HCA under use-biases. Early works proposed that HCA mechanism under high and low biases are different, questioning if the high-bias data can be used for predicting HCA under use-bias. A key advance of this work is proposing a new methodology for evaluating the HCA-induced variation under use-bias. For the first time, the capability of predicting HCA under use-bias is experimentally verified. The importance of separating RTN from HCA is demonstrated. We point out the HCA measured by the commercial Source-Measure-Unit (SMU) gives erroneous power exponent. The proposed methodology minimizes the number of tests and the model requires only 3 fitting parameters, making it readily implementable.
机译:随着CMOS规模的缩小,热载流子老化(HCA)规模扩大,并且可能再次成为限制老化的过程。这促使人们重新审视HCA,但是最近的工作集中在通过增加压力偏向来加速HCA,关于使用偏见下HCA的信息很少。早期的工作提出,在高和低偏差下的HCA机制是不同的,这质疑高偏差数据是否可用于在使用偏差下预测HCA。这项工作的关键进展是提出了一种新的方法,用于评估使用偏见下HCA引起的变异。首次通过实验验证了在使用偏见下预测HCA的能力。证明了将RTN与HCA分开的重要性。我们指出,由商用源测量单位(SMU)测量的HCA给出错误的功率指数。所提出的方法可以最大程度地减少测试次数,并且该模型仅需要3个拟合参数,因此易于实现。

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