首页> 外文会议>China Semiconductor Technology International Conference >A fast 3-D TCAD structure generation method for FinFET devices and circuits simulation
【24h】

A fast 3-D TCAD structure generation method for FinFET devices and circuits simulation

机译:FinFET器件和电路仿真的快速3-D TCAD结构生成方法

获取原文

摘要

FINFET is necessary for CMOS technology scaling down to sub-28nm. 3D TCAD is not only necessary for single device simulation but also important for small scale circuit RC optimization. However, 3-D TCAD process simulation is very time consuming and is currently mainly applied on single device, which makes it not practical for the simulation of small circuit RC optimization in terms of layout and process. In this paper, we adopt an efficient 3-D TCAD simulation method for fast generation of small FinFET circuits. 3D full-structure FinFET inverter, as an example, is realized here to demonstrate the simulation flow. Id-Vg curves of P/NMOS in the inverter were extracted and verified by the results from single device simulation. The total simulation time is compared between the proposed method and brute force method to show the superior simulation efficiency.
机译:FINFET对于CMOS技术缩小至28nm以下是必不可少的。 3D TCAD不仅是单器件仿真所必需的,而且对于小规模电路RC优化也很重要。然而,3-D TCAD过程仿真非常耗时,并且目前主要应用于单个设备,这使得就布局和过程而言,对小型电路RC优化的仿真不切实际。在本文中,我们采用有效的3-D TCAD仿真方法来快速生成小型FinFET电路。此处以3D全结构FinFET逆变器为例,以演示仿真流程。提取了逆变器中P / NMOS的Id-Vg曲线,并通过单器件仿真的结果进行了验证。比较了所提出的方法和蛮力方法的总仿真时间,以显示出优越的仿真效率。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号