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Negative bias instability in 4H-SiC MOSFETS: Evidence for structural changes in the SiC

机译:4H-SiC MOSFET中的负偏置不稳定性:SiC中结构变化的证据

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The negative bias temperature instability (NBTI) has been investigated for quite some time in Si based MOSFETs. In these MOSFETs, the response has been interpreted in several ways, primarily in terms of the reaction diffusion model and newer model based on the occupation of a near interface oxide hole trap triggering the generation of silicon dielectric interface traps. SiC based MOSFETs have enormous promise for high power and high temperature applications. Consequently, device performance at elevated temperatures of these devices is a topic of great current interest. We have begun a magnetic resonance based study of NBTI in 4H-SiC devices and find, among other things, that elevated temperature and negative gate bias generates structural changes (associated with electrically active defects) within the SiC. These observations strongly suggest that SiC NBTI is significantly different and likely more complex than the NBTI processes taking place in silicon based devices. However, other observations suggest that one aspect of NBTI, the occupation of near-interfacial oxide hole traps called E' centers, takes place in both systems.
机译:在基于Si的MOSFET中研究负偏压温度不稳定性(NBTI)已有相当长的时间。在这些MOSFET中,已经以几种方式解释了响应,主要是根据反应扩散模型和新模型,该模型基于触发硅电介质界面陷阱生成的近界面氧化物空穴陷阱的占据。基于SiC的MOSFET在高功率和高温应用中具有广阔的前景。因此,这些设备在高温下的设备性能是当前引起人们极大关注的主题。我们已经开始对4H-SiC器件中的NBTI进行基于磁共振的研究,并且发现,升高的温度和负栅极偏压会在SiC内产生结构变化(与电活性缺陷相关)。这些观察结果强烈表明,SiC NBTI与硅基器件中发生的NBTI工艺明显不同,并且可能更复杂。但是,其他观察结果表明,NBTI的一个方面,即所谓的E'中心的近界面氧化物空穴陷阱的占领,都发生在这两个系统中。

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