III-V semiconductors; MIS devices; etching; fluorine; high electron mobility transistors; semiconductor doping; wide band gap semiconductors; AlGaN-GaN; MOS-HEMT; drain current degradation; etching; fluorine doping; fluorine treatment; multi-faceted mechanisms; Aluminum gallium nitride; Aluminum oxide; Degradation; Gallium nitride; HEMTs; Logic gates; MODFETs;
机译:氧化物厚度依赖性紧凑型频道噪声噪声噪声模型AlGaN / GaN MOS-HEMT
机译:夹在GaN和Al2O3层之间的AIN层对凹陷的AlGaN / GaN MOS-HEMT的性能和可靠性的影响
机译:使用立方样条插值技术将Alinn背屏对Algan / GaN MOS-HEMT的影响利用HFO 2电介质
机译:以原子层沉积的HfLaO
机译:处理表面状态的传输拐点和电荷陷阱对AlGaN / GaN HFET漏极电流的影响。
机译:AlGaN / GaN高电子迁移率氟处理和凹槽通过氟处理和凹陷栅极充电效果
机译:栅极介电质量对在200mm Si衬底上开发无金的D型和E型凹栅AlGaN / GaN晶体管的影响