首页> 外文会议>Conference on metrology, inspection, and process control for microlithography XXVII >Overlay improvement through lot-based feed-forward: applications to various 28nm node lithography operations
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Overlay improvement through lot-based feed-forward: applications to various 28nm node lithography operations

机译:通过基于批次的前馈改善覆盖:应用于各种28nm节点光刻操作

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We introduced a very simple overlay feed forward correction based on lot data issued from previous lithography operations. Simple method for correction factor optimization was also proposed. We applied this method in various cases based on 28nm node early production: implants lithography on 248nm tools, contact holes double patterning on 193nm immersion tool, and we also tried to improve contact holes patterning based on 248nm lithography data. All analysis were based on early production 28nm node data mixing 28LP and 28FDSOI technologies. We first optimized the correction based on our simple approach, and then compute the dispersion of all linear overlay parameters. Maximum modeled overlay error was also computed. In most cases we obtained significant improvements. The interest of such a very simple approach that requires reduced software development and allows simple implementation was thus demonstrated.
机译:我们基于以前的光刻操作发布的批次数据引入了一种非常简单的叠加前馈校正。还提出了一种校正因子优化的简单方法。我们在基于28nm节点早期生产的各种情况下应用了该方法:在248nm工具上植入光刻,在193nm浸没工具上进行接触孔双图案化,并且我们还尝试根据248nm光刻数据来改进接触孔图案化。所有分析均基于早期生产的28nm节点数据混合28LP和28FDSOI技术。我们首先基于简单的方法优化了校正,然后计算了所有线性叠加参数的离散度。还计算了最大建模覆盖误差。在大多数情况下,我们获得了重大改进。因此,表明了这种非常简单的方法的兴趣,该方法要求减少软件开发并允许简单的实现。

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