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Strained Germanium quantum well pMOS FinFETs fabricated on in situ phosphorus-doped SiGe strain relaxed buffer layers using a replacement Fin process

机译:使用替代Fin工艺在原位掺杂磷的SiGe应变松弛缓冲层上制造的应变锗量子阱pMOS FinFET

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Strained Ge p-channel FinFETs on Strain Relaxed SiGe are reported for the first time, demonstrating peak transconductance gmSAT of 1.3mS/μm at VDS=-0.5V and good short channel control down to 60nm gate length. Optimization of P-doping in the SiGe, optimized Si cap passivation thickness on the Ge, and improved gate wrap of the channel all improve device characteristics. The Ge FinFETs presented in this work outperform published relaxed Ge FinFET devices for the gmSAT/SSSAT benchmarking metric.
机译:首次报道了在应变弛豫SiGe上的应变Ge p沟道FinFET,表明在V DS =-0.5V时峰值跨导gm SAT 为1.3mS /μm,良好短通道控制,栅极长度低至60nm。优化SiGe中的P掺杂,优化Ge上的Si盖钝化厚度以及改善沟道的栅包裹性均改善了器件特性。这项工作中展示的Ge FinFET优于已发布的用于gm SAT / SS SAT 基准度量标准的宽松Ge FinFET器件。

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