首页> 外文会议>IEEE International Electron Devices Meeting >Strained Germanium quantum well pMOS FinFETs fabricated on in situ phosphorus-doped SiGe strain relaxed buffer layers using a replacement Fin process
【24h】

Strained Germanium quantum well pMOS FinFETs fabricated on in situ phosphorus-doped SiGe strain relaxed buffer layers using a replacement Fin process

机译:应变锗量子井PMOS FinFET在原位磷掺杂的SiGe菌株放松缓冲层使用替换翅片工艺

获取原文

摘要

Strained Ge p-channel FinFETs on Strain Relaxed SiGe are reported for the first time, demonstrating peak transconductance gmSAT of 1.3mS/μm at VDS=-0.5V and good short channel control down to 60nm gate length. Optimization of P-doping in the SiGe, optimized Si cap passivation thickness on the Ge, and improved gate wrap of the channel all improve device characteristics. The Ge FinFETs presented in this work outperform published relaxed Ge FinFET devices for the gmSAT/SSSAT benchmarking metric.
机译:第一次报告应变弛豫SiGe上的应变GE P沟道FinFET,在V DS = - 0.5V和良好的情况下,证明峰值跨导GM SAT 1.3ms /μm。短通道控制到60nm栅极长度。优化P掺杂在SiGE中,优化的GE上的Si帽钝化厚度,以及沟道的改进栅极包装,所有改善了装置特性。在本工作中呈现的GE FinFET优于GM SAT / SS SAT 基准度量的Proading Be FinFET设备。

著录项

相似文献

  • 外文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号